Ceramic Package

Manufacturer of ceramic substrates (MLC), the main raw material for probe cards used in semiconductor back-end processing

PRODUCT – Probe Card


DRAM (HBM)

  • Layer : ≤40
  • Size : 8"~12"
  • Pl : 1st~4th floors
  • Thin Film : Ti/Cu/Ni/Au (outside)
    Mo (inside)

[Memory STF]
 DRAM (DDR/LPDDR/GDDR)

  • Layer : ≤40
  • Size : 8"~12"
  • Pl : 1st~4th floors
  • Thin Film : Ti/Cu/Ni/Au (outside)
    Mo (inside)


Nand Flash (UFS / eMMC)

  • Layer : ≤40
  • Size : 8"~12"
  • Pl : 1st~4th floors
  • Thin Film : Ti/Cu/Ni/Au (outside)
    Mo (inside)

[Non-Memory STF]
 CIS (Mobile / Automotive)

  • Layer : ≤60
  • Size : 3.5"~7.5"
  • Thin Film : Ti/Cu/Ni/Au (outside)
    Mo (inside)